The Microelectronics Packaging team is seeking a highly motivated person to be a Mechanical Engineering Intern within the Mission Systems Microelectronics Packaging Group. This group is responsible for the Microelectronics Packaging technology activities for Collins Aerospace.
As a Mechanical Engineering Intern you will be involved in the design and development of microelectronics packaging and technologies. Responsibilities for this position will require involvement in a variety of microelectronics packaging efforts. These efforts include: Package design, technology/process development, prototype build & evaluation, qualification testing, failure analysis, factory transition, and manufacturing support.
The successful candidate must have good written and verbal skills, a willingness to learn and expand their technology base, and work well within a diverse team environment. Candidates should be of good standing in one of the following engineering fields: Mechanical, Material, Chemical or Industrial.
Experience / knowledge in the following technical areas are desired:
- Microelectronics design and manufacturing assembly
- Electronic component reliability testing
- Silicon wafer fabrication processes
- Failure analysis techniques
United Technologies Corporation is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.
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